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[2017-2020] : [
SG5
] : [
Q1/5
]
[
Declared patent(s)
]
- [
Publication
]
Work item:
K.35
Subject/title:
Bonding configurations and earthing at remote electronic sites
Status:
Approved on 2020-12-14
Approval process:
AAP
Type of work item:
Recommendation
Version:
Rev.
Equivalent number:
-
Timing:
-
Liaison:
ETSI, IEC
Supporting members:
-
Summary:
Bonding configurations, earthing, and the type of power distribution for equipment located at remote electronic sites are proposed, which are intended to promote harmony of installation and equipment configurations while providing for personnel safety and electromagnetic compatibility.
Comment:
(ex Q5/5 Study period 2013-2016)
Reference(s):
[
SG5-TD1567-R1
]
Historic references:
-
Contact(s):
Huagang WANG
, Editor
ITU-T A.5 justification(s):
-
[
Submit new A.5 justification
]
See guidelines for creating & submitting ITU-T A.5 justifications
First registration in the WP:
2020-10-27 14:37:32
Last update:
2020-12-16 10:21:35
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