Page 51 - ITU Journal Future and evolving technologies Volume 2 (2021), Issue 7 – Terahertz communications
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ITU Journal on Future and Evolving Technologies, Volume 2 (2021), Issue 7





                      FUNDAMENTAL LIMITS OF HIGH-EFFICIENCY SILICON AND COMPOUND
                          SEMICONDUCTOR POWER AMPLIFIERS IN 100-300 GHz BANDS

                       James F. Buckwalter , Mark J. W. Rodwell , Kang Ning , Ahmed Ahmed , Andrea Arias-Purdue ,
                                                                               1
                                                        1
                                                                 1
                                       1
                                                                                                 1
                                              Jeff Chien , Everett O’Malley  and Eythan Lam 1
                                                                    1
                                                     1
                        1 University of California – Santa Barbara, 1160 Harold Frank Hall, Santa Barbara, CA 93106
                                 NOTE: Corresponding author: James Buckwalter, buckwalter@ucsb.edu
          Abstract  –  This  paper  reviews  the  requirements  for  future  digital  arrays  in  terms  of  power  amplifier
          requirements for output power and efficiency and the device technologies that will realize future energy-
          efficient  communication  and  sensing  electronics  for  the  upper  millimeter-wave  bands  (100-300  GHz).
          Fundamental device technologies are reviewed to compare the needs for compound semiconductors and
          silicon processes. Power amplifier circuit design above 100 GHz is reviewed based on load line and matching
          element losses. We present recently presented class-A and class-B PAs based on a InP HBT process that have
          demonstrated record efficiency and power around 140 GHz while discussing circuit techniques that can be
          applied in a variety of integrated circuits.


          Keywords – Digital array, high-efficiency, millimeter-wave, power amplifier


          1.   INTRODUCTION                                    factor,  controlled  with  independent  digitally-
                                                               controlled  Baseband  (BB)  and  Intermediate
          Frequencies  between  100-300  GHz,  known  as       Frequency  (IF),    and  this  poses  a  large-scale
          Upper  millimeter-Wave  (UmmW)  bands,  offer  an    integration  challenge  that  must  be  solved  with
          opportunity for convergence of communication and     unified  design  that  includes  IC,  packaging,  and
          sensing systems to support future high-throughput    device technologies.
          backhaul and radar applications [1]. In particular,
          frequency  bands  located  at  140  and  220  GHz    The large number of array elements in the UmmW
          feature O2  and  H2O  absorption  windows  for  low   array suggests design architecture based on digital
          propagation    loss    in    outdoor    channel      array techniques rather than traditional RF beam-
          environments [2].  Digital  array  applications  in   forming approaches that leverage signal processing
          UmmW  bands  require  mature  electronic  and        techniques based on massive MIMO (mMIMO) for
          packaging  technologies  and  previously  Integrated   higher spatial resolution than conventional MIMO
          Circuits  (IC)  demonstrated  poor  power  efficiency   systems  [3].  Reusing  time-frequency  resources
          and higher package costs when compared to lower      across multiple users can ultimately support higher
          millimeter-wave (LmmW) bands (28/39/60 GHz).         spectral efficiency across a  network and with the
          While other bands, including the 60 GHz bands offer   available bandwidth in UmmW devices link capacity
          substantial  bandwidth,  the  high  absorption  at   might approach 1 Terabit/second [4]. Moreover, a
          60 GHz  prohibits  energy  efficient  operation  over   large  number  of  antennas  will  focus  energy  into
          more  than  a  kilometer  and  UmmW  offers          small  regions  in  the  space.  Thus,  in  theory,  the
          opportunity for high-bandwidth.                      transmit power can be reduced while maintaining a
          Moreover,  the  UmmW  bands  offer  shorter          high Signal-to-Noise Ratio (SNR), resulting in higher
          wavelength  relative  to  LmmW  and  this  feature   spatial energy efficiency. Of course, there is a circuit
          allows  more  Transmit  (TX)  and  Receive  (RX)     overhead  to  generate  the  RF  signals  across  the
          elements  within  a  given aperture  area.  The array   mMIMO  array  which  scales  linearly  with  the
          spacing at 140 GHz would be approximately 1 mm       number of elements. At some point, a larger array
          and,  therefore,  a  1cm  x  1cm  array  could  host   incurs  substantial  power  consumption  penalties.
          around 100 elements while a 28 GHz array might       Early  demonstrations  of  mMIMO  in  sub-6  GHz
          have  only  4  elements  in  the  same  aperture  area.   based on commercially-available software-defined
          Consequently, the UmmW beam-former array will        radios require kilowatts in signal processing [5].
          contain  a  relatively  large  number  of  steerable   Early  work  on  line-of-sight  MIMO  in  millimeter-
          elements that might be packed into the small form    wave  bands  was  demonstrated  nearly  a  decade





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