Page 204 - Cloud computing: From paradigm to operation

1 Framework and requirements for cloud computing

Table I.5 – Relationship with related specifications from other SDOs

NO. Requirements in this Relationship with related specifications from other SDOs
Recommendation
2 CPU replacement – [b-OCP 2S] provides CPU replacement as 'The motherboard supports all
Intel Xeon Scalable processor family (aka Skylake-SP) processors with TDP
up to 165W. The motherboard shall provision the support of all future CPUs
in Intel Xeon Scalable processor Family Platform and the Next gen Intel Xeon
Scalable processor Family Platform unless noted otherwise' in clause 5.3.1.
– [b-OCP HSAS] provides CPU replacement as 'The motherboard is designed to
support dual Intel Xeon E5-2600 v3 and v4 series processors and up to
2048GB LRDIMM 3DS/1024GB LRDIMM/ 512GB RDIMM DDR4 memory.
Leveraging advanced technology from Intel, the motherboard is capable of
offering scalable 32- and 64-bit computing, high-bandwidth memory design
and lightning-fast PCI-E bus implementation' in clause 7.
– [b-OCP MB] provides CPU replacement as 'The motherboard uses Intel Xeon
E5-2600 v3 (LGA2011-3) Product Family processors with TDP up to 145W.
The features listed below must be supported by the motherboard: Support
two Intel Xeon E5-2600 v3 (LGA2011-3) Product Family processors up to
145W TDP and vendors should engage with Intel to ensure the design ready
for future processors; Two full-width Intel QPI links up to 9.6 GT/s/direction;
Up to 18 cores per CPU (up to 36 threads with Hyper-Threading
Technology). Up to 45MB last level cache; Single Processor mode is
supported' in clause 5.3.1.
3 Multiple CPUs – [b-OCP 2S] provides multiple CPUs as 'Support two Intel XeonScalable
processor family (aka Skylake-SP) processors up to 165W TDP and vendors
should engage with Intel to ensure the design ready for future processors' in
clause 5.3.1.
– [b- OCP AMBH] provides multiple CPUs as 'The motherboard supports two
AMD G34 Magny Cours or Interlagos CPUs with a TDP (thermal design
power) of 115W' in clause 4.3.
– [b- OCP DSBS] provides multiple CPUs as 'Support up to two processors with
a thermal design point (TDP) of up to 135 W' in clause 4.
– [b- OCP DSBS] provides multiple CPUs as 'Support up to two processors
using LGA2011-3 (socket type R3) and VRD 12.5 and a thermal design point
(TDP) of up to 145W' in clause 4.
– [b-OCP HSAS] provides multiple CPUs as 'The motherboard is designed to
support dual Intel Xeon E5-2600 v3 and v4 series processors and up to
2048GB LRDIMM 3DS/1024GB LRDIMM/ 512GB RDIMM DDR4 memory.
Leveraging advanced technology from Intel, the motherboard is capable of
offering scalable 32- and 64- bit computing, high-bandwidth memory design
and lightning-fast PCI-E bus implementation' in clause 7.
– [b-OCP IMBH] provides multiple CPUs as '2 Intel Xeon E5-2600 (LGA2011)
series processors up to 115W' in clause 4.3.
– [b-OCP OAPM] provides multiple CPUs as 'Sockets: Dual socket operation' in
clause 5.
– [b-OCP MB] provides multiple CPUs as 'The motherboard uses Intel Xeon E5-
2600 v3 (LGA2011-3) Product Family processors with TDP up to 145W. The
features listed below must be supported by the motherboard: Support two
Intel Xeon E5-2600 v3 (LGA2011-3) Product Family processors up to 145W
TDP and vendors should engage with Intel to ensure the design ready for
future processors; Two full-width Intel QPI links up to 9.6 GT/s/direction; Up
to 18 cores per CPU (up to 36 threads with Hyper-Threading Technology).
Up to 45MB last level cache; Single Processor mode is supported' in
clause 5.3.1.

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