Page 205 - Cloud computing: From paradigm to operation

Framework and requirements for cloud computing 1

Table I.5 – Relationship with related specifications from other SDOs

NO. Requirements in this Relationship with related specifications from other SDOs
Recommendation
4 Low power – [b-OCP 2S] provides Low power consumption of CPU as 'Tuning CPU/Chipset
consumption of CPU settings to reach minimized power consumption and best performance in a
data centre environment' in clause 6.3.1.
– [b- OCP 2S] provides Low power consumption of CPU as 'The vendor should
implement BMC firmware to support platform power monitoring. To enable
power limiting for processor, memory and platform, Intel Server Platform
Services-NM is required' in clause 9.8.
– [b- OCP 2S] provides Low power consumption of CPU as 'CPU VR
optimizations shall be implemented to remove cost and increase the
efficiency of the power conversion system' in clause 15.3.2.
– [b-OCP G1] provides Low power consumption of CPU as 'The motherboard
shall be designed to handle a processor with a maximum TDP of 190W CPU'
in clause 7.3.1
– [b- OCP DSBS] provides Low power consumption of CPU as 'Support up to
two processors with a thermal design point (TDP) of up to 135 W' in
clause 4.
– [b-OCP AMBH] provides Low power consumption of CPU as 'The CPU VRM is
optimized to reduce cost and increase the efficiency of the power
conversion system' in clause 9.1.5.
– [b- OCP DSBS] provides Low power consumption of CPU as 'Support up to two
processors using LGA2011-3 (socket type R3) and VRD 12.5 and a thermal
design point (TDP) of up to 145W' in clause 4.
– [b-OCP IMBH] provides Low power consumption of CPU as 'The
motherboard uses next generation Intel Xeon processor E5-2600 product
family CPUs with a TDP (thermal design power) up to 115W' in clause 4.3.
– [b-OCP IMBH] provides Low power consumption of CPU as 'Two to monitor
temperatures for CPU0 and CPU1, retrieved through the CPU's temperature
sensor interface (PECI)' in clause 6.1.
– [b-OCP MB] provides Low power consumption of CPU as 'The motherboard
uses Intel Xeon E5-2600 v3 (LGA2011-3) Product Family processors with TDP
up to 145W. The features listed below must be supported by the
motherboard: Support two Intel Xeon E5-2600 v3 (LGA2011-3) Product
Family processors up to 145W TDP and vendors should engage with Intel to
ensure the design ready for future processors; Two full-width Intel QPI links
up to 9.6 GT/s/direction; Up to 18 cores per CPU (up to 36 threads with
Hyper-Threading Technology). Up to 45MB last level cache; Single Processor
mode is supported' in clause 5.3.1.
– [b-OCP MB] provides Low power consumption of CPU as 'The BIOS should
be tuned to minimize system power consumption and maximize
performance. This includes: Disable any unused devices, such as unused PCI,
PCIe ports, USB ports, SATA/SAS ports, clock generator and buffer ports.
Tuning CPU/Chipset settings to reach minimized power consumption and
best performance in a data centre environment' in clause 6.3.1.

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