Page 217 - Cloud computing: From paradigm to operation

Framework and requirements for cloud computing 1

Table I.5 – Relationship with related specifications from other SDOs

NO. Requirements in this Relationship with related specifications from other SDOs
Recommendation
– [b-OCP 2S] provides device driver support as 'All data network and
management network should have this capability. This includes, but not
limit to: DHCP and static IP setting, PXE booting capability, NIC and BMC
firmware support, OS driver and utility in both IPv4 and IPv6' in
clause 11.4.3.
– [b-OCP AMBH] provides device driver support as 'The x4 connector can be
hot inserted and removed. A PCI-E re-driver is used for PCI-E external links
and supports a miniSAS cable up to 2 meters long' in clause 10.3.
– [b-OCP TP] provides device driver support as 'It is recommended that PCB is
planned with three vendors at EVT. EVT and DVT build plan should cover all
possible combinations of key components of DC-DC VR including output
inductor, MOSFETs and driver' in clause 18.9.
40 Processing unit – [b-OCP 1S] provides power operation as 'server shall have the power
operation monitoring capability to read power consumption reliably and accurately
and can report a one-second average power reading with 3% accuracy' in
clause 8.4.
– [b-OCP 2S] provides monitoring information as 'BMC should implement
thermal monitoring feature for PCIe card on riser and Mezzanine card. BMC
reads the temperature of key components of PCIe and Mezzanine cards
through its SMBus ports in the format as TMP421 temperature sensor. BMC'
in clause 9.18.
– [b-OCP AMBH] provides monitoring information as 'The ODM needs to
provide a system access interface and application to retrieve hardware
monitoring sensor readings, including at minimum, lm_sensors, a Linux
application for the CentOS operating system and its driver' in clause 6.
– [b-OCP AMBH] provides power operation as 'The motherboard includes a
power switch, reset switch, power LED, HDD activity LED and beep error
LED' in clause 10.9.
– [b-OCP Yose] provides monitoring information as 'The BMC firmware shall
support platform power monitoring. The BMC firmware shall support
thermal monitoring' in clause 6.13.
– [b-OCP DSBS] provides monitoring information as 'The management
controller SHALL support the following IPMI features: Sensor device and
sensor scanning/monitoring' in clause 8.11.
– [b-OCP NIC] provides monitoring information as 'When the temperature
sensor reporting function is implemented, the OCP NIC 3.0 card shall
support PLDM for Platform Monitoring and Control (DSP0248 1.1 compliant)
for temperature reporting' in Table 49: Temperature Reporting
Requirements.
41 Remote management – [b-ETSI EVE007] provide Remote management as 'The BMC/service
processor shall be accessible remotely via Ethernet network' in clause 5.6.2.
– [b-OCP 1S] provides remote BIOS update as 'The BIOS can be updated
remotely under these scenarios' in clause 9.6.8.
– [b-OCP 2S] provides remote BIOS update as 'Vendors should provide tool(s) to
implement remote BIOS update function' in clause 6.3.6.
– [b-OCP AMBH] provides remote BIOS firmware update as 'The motherboard
has SP5100 interfaces on board, which support up to six SATA ports' in
clause 7.6.
– [b-OCP AMBH] provides remote power control as 'The BMC supports
remote system power on/off and reboot through LAN or IPMB' in clause 7.4.

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