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1                                    Framework and requirements for cloud computing




                              Table I.5 – Relationship with related specifications from other SDOs

              NO.     Requirements in this          Relationship with related specifications from other SDOs
                       Recommendation
                                           –  [b-OCP HSCH] describes how the BIOS is tuned to minimize card power
                                              consumption. It has the following features: • Unused devices are disabled
                                              including PCIe* lanes, USB ports, SATA/SAS ports, etc.; • BIOS setup menu;
                                              • SOC settings are provided to allow tuning to achieve the optimal
                                              combination of performance and power consumption' in clause 8.5.2.
                                           –  [b-OCP HSCH] describes how each card must provide temperature sensors
                                              for the SOC, the SO-DIMM(s) (if they are used) and one ambient
                                              temperature sensor. All temperature readings for each sensor must be
                                              readable via the management sideband interface to the baseboard.
                                              Additionally, over-temperature thresholds are configurable and an alert
                                              mechanism is provided to enable thermal shutdown and/or an increase in
                                              airflow. The sensors are accurate to +/−3C' in clause 5.4.
               20    Interface for         –  [b-ETSI EVE007] provides interface for monitoring power as 'Each power
                     monitoring power         supply unit should be capable of measuring and remotely reporting the
                                              following operational parameters' in clause 5.3.4.2.
                                           –  [b-OCP 1S] describes how the Twin Lakes 1S server shall uses power sensor
                                              to measure Card and SoC power consumption. The power data can be used
                                              by the platform for power management purposes. The Twin Lakes 1S server
                                              supports an Advanced Configuration Power Interface (ACPI)-compliant
                                              power button and reset signals from the platform, in clause 3 overview and
                                              clause 6.5.
                                           –  [b-OCP AMBH] describes how to use BMC to monitor power in clause 7.2
                                              and use PMBUS interface to enable the BMC to report server input power in
                                              clause 8.6.
                                           –  [b-OCP DSBS] describes how Decathlete Server Board shall support power
                                              supply redundancy monitoring and support in clause 8.1.2.
                                           –  [b-OCP TP] requires vendors to implement BMC firmware to support remote
                                              system power on/off/cycle and warm reboot through In-Band or Out-of-
                                              Band IPMI commands in clause 8.4 and support platform power monitoring
                                              in clause 8.8.
               21    Cooling component     –  [b-OCP 2S] describes that if and only if one rotor in server fan fails, the
                     replacement              negative or positive DC pressurization can be considered in the thermal
                                              solution in the hot aisle or in cold aisle respectively in clause 10.2.4.

               22    Cooling component     –  [b-OCP 2S] provides a description of fan redundancy which is one
                     redundancy               implementation of cooling redundancy – as 'the server fans at N+1
                                              redundancy should be sufficient for cooling server components to
                                              temperatures below their maximum spec to prevent server shut down or to
                                              prevent either CPU or memory throttling' in clause 10.2.5.
                                           –  [b-OCP O1USM] requires fans to be N+2 redundant to optimize fan
                                              efficiency and server availability while eliminating the need for hot swap
                                              capability in clause 4.4.
                                           –  [b-OCP O2USM] requires fans to be N+2 redundant to optimize fan
                                              efficiency and server availability while eliminating the need for hot swap
                                              capability in clause 4.4.
                                           –  [b-OCP TP] describe how server fans should be N+1 redundancy to be
                                              sufficient for cooling server components to temperatures below their
                                              maximum spec to prevent server shut down or to prevent either CPU or
                                              memory throttling in clause 9.2.5. [b-ETSI EVE007] provides Cooling
                                              component redundancy as 'Redundancy within the rack cooling system shall
                                              provide appropriate levels of cooling to all the rack equipment while the rack
                                              cooling system is serviced' in clause 5.5.3.


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