Page 212 - Cloud computing: From paradigm to operation
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1 Framework and requirements for cloud computing
Table I.5 – Relationship with related specifications from other SDOs
NO. Requirements in this Relationship with related specifications from other SDOs
Recommendation
– [b-OCP HSCH] describes how the BIOS is tuned to minimize card power
consumption. It has the following features: • Unused devices are disabled
including PCIe* lanes, USB ports, SATA/SAS ports, etc.; • BIOS setup menu;
• SOC settings are provided to allow tuning to achieve the optimal
combination of performance and power consumption' in clause 8.5.2.
– [b-OCP HSCH] describes how each card must provide temperature sensors
for the SOC, the SO-DIMM(s) (if they are used) and one ambient
temperature sensor. All temperature readings for each sensor must be
readable via the management sideband interface to the baseboard.
Additionally, over-temperature thresholds are configurable and an alert
mechanism is provided to enable thermal shutdown and/or an increase in
airflow. The sensors are accurate to +/−3C' in clause 5.4.
20 Interface for – [b-ETSI EVE007] provides interface for monitoring power as 'Each power
monitoring power supply unit should be capable of measuring and remotely reporting the
following operational parameters' in clause 5.3.4.2.
– [b-OCP 1S] describes how the Twin Lakes 1S server shall uses power sensor
to measure Card and SoC power consumption. The power data can be used
by the platform for power management purposes. The Twin Lakes 1S server
supports an Advanced Configuration Power Interface (ACPI)-compliant
power button and reset signals from the platform, in clause 3 overview and
clause 6.5.
– [b-OCP AMBH] describes how to use BMC to monitor power in clause 7.2
and use PMBUS interface to enable the BMC to report server input power in
clause 8.6.
– [b-OCP DSBS] describes how Decathlete Server Board shall support power
supply redundancy monitoring and support in clause 8.1.2.
– [b-OCP TP] requires vendors to implement BMC firmware to support remote
system power on/off/cycle and warm reboot through In-Band or Out-of-
Band IPMI commands in clause 8.4 and support platform power monitoring
in clause 8.8.
21 Cooling component – [b-OCP 2S] describes that if and only if one rotor in server fan fails, the
replacement negative or positive DC pressurization can be considered in the thermal
solution in the hot aisle or in cold aisle respectively in clause 10.2.4.
22 Cooling component – [b-OCP 2S] provides a description of fan redundancy which is one
redundancy implementation of cooling redundancy – as 'the server fans at N+1
redundancy should be sufficient for cooling server components to
temperatures below their maximum spec to prevent server shut down or to
prevent either CPU or memory throttling' in clause 10.2.5.
– [b-OCP O1USM] requires fans to be N+2 redundant to optimize fan
efficiency and server availability while eliminating the need for hot swap
capability in clause 4.4.
– [b-OCP O2USM] requires fans to be N+2 redundant to optimize fan
efficiency and server availability while eliminating the need for hot swap
capability in clause 4.4.
– [b-OCP TP] describe how server fans should be N+1 redundancy to be
sufficient for cooling server components to temperatures below their
maximum spec to prevent server shut down or to prevent either CPU or
memory throttling in clause 9.2.5. [b-ETSI EVE007] provides Cooling
component redundancy as 'Redundancy within the rack cooling system shall
provide appropriate levels of cooling to all the rack equipment while the rack
cooling system is serviced' in clause 5.5.3.
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