[107] Liaison statement on "Request for feedback on the terms "Digital application layer", "Digital infrastructure layer", "Digital platform layer", "Industrial smart energy management system" and "Intelligent Internet of things platform" developed by ITU-T Study Group 5

Página principal : UIT-R : R23-WP1B : Contribuciones : 107

Nuevo - Busque los documentos de la reunión

	Formato	Tamaño	Puesta a disposición

English	Word	34130 octetos	2026-06-19	[107]

Documento :	UIT-R R23-WP1B Contribución 107
Título :	Liaison statement on "Request for feedback on the terms "Digital application layer", "Digital infrastructure layer", "Digital platform layer", "Industrial smart energy management system" and "Intelligent Internet of things platform" developed by ITU-T Study Group 5
Recibido en :	2026-06-19
Origen :	ITU-T SG5
Disponibilidad :	Restringido a usuarios de TIES [UIT-R]