Contributions
[ Source: Qualcomm, Inc. ] [ AI/Question: Q3/12 ]  |
|
Number
|
Title
|
Source
|
AI/Question
|
Date
|
|
[ 365 ]
|
Verification results for P.381 and P.MMIC
|
Qualcomm, Inc.
|
Q3/12
|
2016-05-24 |
|
[ 358 ]
|
Updated Draft P.MMIC Specification for Approval
|
Qualcomm, Inc.
|
Q3/12
|
2016-05-24 |
|
[ 338 ]
(Rev.1) |
Recommendation ITU-T P.MMIC "Technical requirements and test methods for multi-microphone wired headset or headphone interfaces of digital wireless terminals"
|
Qualcomm, Inc.
|
Q3/12
|
2015-12-23 |
|
[ 334 ]
(Rev.1) |
Verification Report for P.MMIC and P.381 ".Universal wired headset or headphone interface of digital mobile terminals"
|
Qualcomm, Inc.
|
Q3/12
|
2015-12-23 |
|
[ 333 ]
(Rev.1) |
Verification Report for P.381 and P.MMIC ".Universal wired headset or headphone interface of digital mobile terminals"
|
Qualcomm, Inc.
|
Q3/12
|
2015-12-23 |
|
[ 277 ]
|
Recommendation ITU-T P.MMIC "Technical requirements and test methods for multi-microphone wired headset or headphone interfaces of digital wireless terminals"
|
Qualcomm, Inc.
|
Q3/12
|
2015-04-22 |
|
[ 254 ]
|
P.381 Harmonization of Audio Connector Mechanical Properties
|
Qualcomm, Inc.
,
Sony Corporation
|
Q3/12
|
2015-04-21 |
|
[ 253 ]
|
P.381 Harmonization of the Headset Button Interface
|
Qualcomm, Inc.
,
Sony Corporation
|
Q3/12
|
2015-04-21 |
|
[ 223 ]
|
Draft Recommendation ITU-T P.MMIC "Technical requirements and test methods for multi-microphone wired headset or headphone interfaces of digital wireless terminals"
|
Qualcomm, Inc.
|
Q3/12
|
2014-08-20 |
|
[ 146 ]
|
Standardizing additional electrical connector pins for headsets
|
Qualcomm, Inc.
|
Q3/12
|
2013-11-20 |
|
[ 144 ]
|
Suggestions regarding P.381 Draft version 2.0
|
Qualcomm, Inc.
,
Sony Corporation
|
Q3/12
|
2013-11-20 |
|
[ 78 ]
|
Proposal of 3.5 mm backwards compatible connector with additional pins
|
Qualcomm, Inc.
|
Q3/12
|
2013-03-06 |
Results:12 total items.
|
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