1 Scope
2
References
3
Definitions
4
Abbreviations
5
Measurement modes and events to be monitored
5.1 Definition of the measurement modes
5.2 Events to be monitored
5.2.1 Network events
5.2.2 Test signal structure events
5.3 Out-of-service measurement modes
5.3.1 Mode with higher-order container (C-4)
end-to-end transparency
5.3.1.1 For an STM-N
Regenerator section
5.3.1.1.1 Events to be
monitored
5.3.1.1.2 Test signal
structures to be used
5.3.1.2 For an STM-N
Multiplex section
5.3.1.2.1
Events to be monitored
5.3.1.2.2 Test signal
structures to be used
5.3.1.3 For a higher-order
VC-4 path
5.3.1.3.1 Events to be
monitored
5.3.1.3.2 Test signal
structures to be used
5.3.2 Mode with higher-order container (C-3)
end-to-end transparency
5.3.2.1 For an STM-N
regenerator section
5.3.2.1.1 Events to be
monitored
5.3.2.1.2 Test signal
structures to be used
5.3.2.2 For an STM-N
Multiplex Section
5.3.2.2.1 Events to be monitored
5.3.2.2.2 Test signal
structures to be used
5.3.2.3 For a higher-order
VC-3 path
5.3.2.3.1 Events to be
monitored
5.3.2.3.2
Test signal structures to be used
5.3.3 Mode with lower-order container (C-3)
end-to-end transparency
5.3.3.1 Events to be
monitored
5.3.3.2 Test signal structures to be used
5.3.4 Mode with lower-order container
(C-11/C-12/C-2) end-to-end transparency
5.3.4.1 Events to be
monitored
5.3.4.2 Test signal
structures to be used
5.3.5 Mode with plesiochronous tributary
mapping in a higher-order container (C-4)
5.3.5.1 Events to be
monitored
5.3.5.2 Test signal structures
to be used
5.3.6 Mode with plesiochronous tributary
mapping in a higher-order container (C-3)
5.3.6.1 Events to be
monitored
5.3.6.2 Test signal structures
to be used
5.3.7 Mode with a plesiochronous tributary
mapping in a lower-order container (C-3)
5.3.7.1 Events to be
monitored
5.3.7.2 Test signal
structures to be used
5.3.8 Mode with a plesiochronous tributary
mapping in a lower‑order container (C‑11/C‑12/C-2)
5.3.8.1 Events to be
monitored
5.3.8.2 Tests signal
structures to be used
5.3.9 Mode with concatenated structures
(VC-2-mc and VC-4-Xc) end-to-end transparency
5.4 In-service measurement modes
5.4.1 Events to be monitored for a STM-N
Regenerator section
5.4.2 Events to
be monitored for a Multiplex section
5.4.3 Events to be monitored for a higher-order
container (C-4)
5.4.4 Events to be monitored for a higher-order
container (C-3)
5.4.5 Events to be monitored for a lower-order
container (C-3)
5.4.6 Events to be monitored for a lower-order
container (C-11/C-12/C-2)
5.4.7 Events to be monitored for VC-2-mc and
VC-4-Xc concatenated structures
6
Generator
6.1 Synchronization of the generator
6.2 Bit rates
6.3 Test signal structures
6.4 Digital signal outputs
6.4.1 Digital interfaces
6.4.2 Output jitter
7
Receiver
7.1 Digital signal inputs
7.1.1 Digital interfaces
7.1.2 Input jitter tolerance
7.1.3 Protected monitoring points
7.1.3.1 Electrical protected monitoring points
7.1.3.2 Optical protected
monitoring points
7.2 Test signal structures
7.3 Error performance measurement
7.3.1 Error performance measurement using ISM
facilities only
7.3.1.1 Type of measurement
7.3.1.2 Error performance
Events
7.3.1.3 Error Performance
Parameters
7.3.2 Error measurement using both ISM
facilities and test sequence information
7.3.3 Use of the performance parameters
7.3.4 Additional error measurement
8
Miscellaneous functions
8.1 Display
8.2 Anomaly and defect addition on the output signal
8.3 Alarm and error indication
8.4 Access to overhead bytes
8.5 Demultiplexing capability
8.6 Events time stamping
8.7 Output to external recording devices
8.8 Remote control port
8.9 TMN interface
8.10 Access to Data Communication Channels
9
Operating conditions
9.1 Environmental conditions
9.2 Behaviour in case of power failure
Annex A – Criteria for
detecting anomalies and defects
A.1 Anomalies related to performance measurements
A.1.1 Out Of Frame (OOF)
A.1.2 B1 errors
A.1.3 B2 errors
A.1.4 B3
errors
A.1.5 Multiplex Section Remote Error Indication
(MS-REI)
A.1.6 Higher-order Path Remote Error Indication
(HP-REI)
A.1.7 Lower-order Path Remote Error Indication
(LP-REI)
A.1.8 BIP-2 errors
A.1.9 Test Sequence Error (TSE)
A.2 Defects related to performance measurements
A.2.1 Loss Of Signal (LOS)
A.2.2 Loss Of Frame (LOF)
A.2.3 Regenerator Section Trace Identifier
Mismatch (RS-TIM)
A.2.4 Multiplex Section Alarm Indication Signal
(MS-AIS)
A.2.5 Multiplex Section Remote Defect
Indication (MS-RDI)
A.2.6
Administrative Unit Loss Of Pointer (AU-LOP)
A.2.7 Administrative Unit Alarm Indication
Signal (AU-AIS)
A.2.8 Higher-order Path Remote Defect
Indication (HP-RDI)
A.2.9 Higher-order Path Trace Identifier
Mismatch (HP-TIM)
A.2.10 Tributary Unit Loss Of Multiframe
(TU-LOM)
A.2.11 Tributary Unit Loss Of Pointer (TU-LOP)
A.2.12 Tributary Unit Alarm Indication Signal
(TU-AIS)
A.2.13 Lower-order Path Remote Defect Indication
(LP-RDI)
A.2.14 Lower-order Path Trace Identifier
Mismatch (LP-TIM)
A.2.15 Loss of Sequence Synchronization (LSS)
A.3 Other events not related to performance measurement
A.3.1 Higher-order Path PayLoad Mismatch
(HP-PLM)
A.3.2 Lower-order Path PayLoad Mismatch
(LP-PLM)
A.3.3 Higher-order Path unequipped (HP-UNEQ)
A.3.4 Lower-order Path unequipped (LP-UNEQ)
A.3.5 Loss of timing input
A.3.6 Lower-order Path Remote Failure
Indication (LP-RFI)
A.4 Other information
A.4.1 Administrative Unit Pointer Justification
Events (AU-PJE)
Annex B – Classification of
SDH available indications
Annex C – List of test signal
structures
C.1 Test signal structure TSS1 applied to all bytes of a C-4
higher-order container
C.2 Test signal structure TSS2 applied to all bytes of a C-3
higher-order container
C.3 Test signal structure TSS3 applied to all bytes of a C-3
lower-order container
C.4 Test signal structure TSS4 applied to all bytes of (C-2, C-12,
C-11) lower-order containers
C.5 Test signal structure TSS5 applied to all PDH tributary bits
mapped in a C-4 container
C.6 Test signal structure TSS6 applied to all PDH tributary bits
mapped in a higher-order C‑3 container
C.7 Test signal structure TSS7 applied to all PDH tributary bits
mapped in a lower-order C‑3 container
C.8 Test signal structure TSS8 applied to all PDH tributary bits
mapped in a lower-order (C‑2, C‑11, C-12) container
C.9 Test signal
structure applied to concatenated structures
Appendix I – Examples of measuring equipment connections
to network elements illustrating
different out‑of‑service measurement modes