Rec. ITU-T K.35 (12/2020) Bonding configurations and earthing at remote electronic sites
Summary
History
FOREWORD
Introduction
1 Scope
2 References
3 Definitions
     3.1 Terms defined elsewhere
     3.2 Terms defined in this Recommendation
4 Abbreviations and acronyms
5 Conventions
6 Earthing network for electronic equipment enclosures (EEEs)
     6.1 Earthing ring for above ground and below ground EEEs
     6.2 Earthing ring for EEC
     6.3 Concrete-encased earth electrode
7 a.c. power distribution
     7.1 a.c. power line surge protective device
8 d.c. power distribution
9 Bonding configuration
     9.1 Main earthing terminal
     9.2 Interior bonding-bus
          9.2.1 Ring bonding-bus for AG/EEE and BG/EEE
          9.2.2 Bonding-bus for EEC
     9.3 Outside-plant cable entrance
          9.3.1 Location of entry ports
          9.3.2 Bonding of metallic components
     9.4 Equipment framework
     9.5 Surge protectors on communication pairs
     9.6 Metallic walls
Appendix I  Example of bonding configurations and earthing of EEEs by use of ring bonding-bus
Appendix II   Example of A.C. power line surge protective device
Appendix III   Example of Bonding-bus for EEC
Bibliography