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[18-GEN]  Incoming LS: Liaison to ITU-T SG5 on ETSI standard for Earthing and bonding of 400 VDC

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1198582 bytes 2012-12-11 [18-GEN] 
 

Group : ITU-T SG 5  (Study Period 2013) - Environment and climate change

Document : Temporary Document  18-GEN - Incoming LS: Liaison to ITU-T SG5 on ETSI standard for Earthing and bonding of 400 VDC

Received on : 2012-12-11

Source : ETSI TC EE

Question(s) : Q19/5, Q5/5

Access : Restricted to TIES users [ITU-T]

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Updated : 2012-12-11