With the rapid progress of the telecommunication terminal technology, more and more converged devices are appearing on the market. As the modules of the converged devices are so close together, if the PCB board is not designed properly, without good grounding, shielding or filtering, an EMC disturbance can occur between the modules. This Recommendation analyses the EMC disturbance between different modules in converged terminal devices and defines a conducted test method. This mutual-disturbance test can be used as one of the immunity test items listed in [ITU-T K.34] and [ITU-T K.48] to determine the level of performance degradation.