CONTENTS

1     Scope 
 2     References
        2.1     Normative references       
        2.2     Informative references     
        2.3     Reference acquisition       
 3     Terms and definitions    
 4     Abbreviations, acronyms and conventions        
        4.1     Abbreviations and acronyms       
        4.2     Conventions         
 5     Technical overview        
        5.1     System architecture          
        5.2     Bonding services model   
        5.3 Multiple services model   
6     DEPI architecture          
        6.1     DEPI Data Path   
        6.2     Networking considerations          
        6.3     System timing considerations      
 7     DEPI control plane        
        7.1     Topology  
        7.2     Addressing           
        7.3     Control message format   
        7.4     Signalling 
        7.5     AVP definitions   
 8     DEPI forwarding plane 
        8.1     L2TPv3 transport packet format  
        8.2     DOCSIS MPT mode       
        8.3     PSP mode
        8.4     DEPI latency measurement (DLM) sublayer header       
        8.5     M-CMTS core output rate           
Annex A – DEPI MTU     
        A.1     L2TPv3 lower layer payload size
        A.2     Maximum frame size for DEPI   
        A.3     Path MTU discovery       
Annex B – Parameters and constants     
Appendix I – DEPI and DOCSIS system performance     
        I.1       Introduction       
        I.2       Round-trip time and performance          
        I.3       Elements of round-trip time       
        I.4       CIN characteristics         
        I.5       Queueing delays in network elements   
        I.6       Traffic prioritization and network delays          
        I.7       Queue persistence in a DEPI flow         
        I.8       PSP mode           
Appendix II – Early adoption and evolving use of EQAM devices     
       II.1 EQAM development: Category A (no DTI)       
       II.2     EQAM development: Category B (with DTI)    
       II.3     Possible M-CMTS feature phasing          
       II.4     Optional UDP layer